Shenzhen Changkeshun Technology Co., Ltd.

Excellent management system and certification

Changkeshun Technology is a high-tech enterprise specializing in electronic assembly and processing. The pass rate of

processed products is more than 99.8%. SMT process:components from 0201 and above. QFN and BGA can be pasted

with 0.15 pitch; 5 DIP welding lines with wave soldering processing, lead and lead-free technique can be provided in saparate

workshop; 4 finished product assembly lines.We have passed the ISO9001 quality system certification, so as to fully ensure

that all aspects of the customer's requirements for the product are met;

High requirements, high standards, high quality:

BGA QFN packaging materials, X-RAY full inspection; AOI inspection
Use imported solder paste;
Proofing to do the first prototype inspection;
4000 square meters dust-free anti-static constant temperature &humidity workshops

Max panel size		32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)
Min thickness(inner layer)		4 mil(0.1mm)
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm
	±10%	±10%
	±10%	±10%
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm
Hole precision		±2 mil(±50 um)
tolerance for Slot		±3 mil(±75 um)
tolerance for PTH		±3 mil(±75um)
tolerance for NPTH		±2mil(±50um)
Max Aspect Ratio for PTH		8:1
Hole wall copper thickness		15-50um
Alignment of outer layers		4mil/4mil
Min trace width/space for outer layer		4mil/4mil
Tolerance of Etching		+/-10%
Thickness of solder mask	on trace	0.4-1.2mil(10-30um)
	at trace corner	≥0.2mil(5um)
	On base material	≤+1.2mil Finished thickness
Hardness of solder mask		6H
Alignment of solder mask film		±2mil(+/-50um)
Min width of solder mask bridge		4mil(100um)
Max hole with solder plug		0.5mm
Surface finish		HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger		280u"(7um)
Max gold thickness for Gold finger		30u"(0.75um)
Nickel thickness in Immersion Gold		120u"/240u"(3um/6um)
Gold thickness in Immersion Gold		2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance		50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength		≥61B/in(≥107g/mm)
bow and twist		0.75%

Quality